COMLAC is a multi-functional small form factor computer core module, developed by NODKA and followed X86 modular bus standard. Based on years of experience and research with ETX, COM Express, Qseven, SMARC modular bus and combined with latest technology and…
Nodka 3rd Gen Fanless 4U IPC Wins Innovative Product Award In Gonkong 14th selected activities of Automation Annual Meeting, Nodka the 3rd generation fanless 4U IPC won the “Innovative Product Award”, after the users expertjury, network users and industrial control…
Chinese New Year Holiday Notification Dear customer and partners, Nodka Chinese New Year holidy plan: February 5, 2024 – February 18, 2024. During this period, the factory is closed, and no delivery from China. All the production will back to…
Recent Posts
- OEM vs ODM for Industrial PCs: How Automation OEMs Can Control Lifecycle Risk
- Nodka Exhibits at Embedded World 2026 Booth 3-263
- CODESYS Tech Talk Video: High-Performance EtherCAT Motion Control with NODKA IPCs
- Physical AI at the Edge: NODKA Showcases Embodied Intelligence Robot Controller at CES 2026 with Intel
- NODKA IPC-615H5-Q670 Featured in Intel® Edge AI Catalog
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