Nodka Team Attending PACK EXPO International 2024

The Nodka team will be attending PACK EXPO International 2024 this week, from November 3–6 at McCormick Place in Chicago, Illinois. PACK EXPO is the premier event for the packaging and processing industry, bringing together professionals and innovators to explore the latest advancements in packaging machinery, materials, and automation.

As we focus on driving efficiency and connectivity in industrial automation, we look forward to seeing cutting-edge solutions and meeting with industry experts who are shaping the future of packaging technology. This event provides an excellent platform for us to deepen our understanding of the evolving packaging needs and explore how our automation computers, fanless PCs, and industrial touch panels can further enhance productivity and streamline operations for manufacturers.

Our team is eager to connect with partners, customers, and thought leaders to exchange ideas on improving control systems, optimizing data processing, and leveraging automation to meet the growing demands of the packaging industry.

If you’re attending PACK EXPO and would like to discuss how Nodka’s industrial PC solutions can help elevate your automation processes, we’d love to connect!

Stay tuned for live updates from the event. For more details about PACK EXPO International, visit packexpointernational.com.