COMLAC is a multi-functional small form factor computer core module, developed by NODKA and followed X86 modular bus standard. Based on years of experience and research with ETX, COM Express, Qseven, SMARC modular bus and combined with latest technology and…
Nodka 3rd Gen Fanless 4U IPC Wins Innovative Product Award In Gonkong 14th selected activities of Automation Annual Meeting, Nodka the 3rd generation fanless 4U IPC won the “Innovative Product Award”, after the users expertjury, network users and industrial control…
Recent Posts
- SPS Americas 2025 – Focused on IPCs, HMIs, Edge Computing & AI Control
- Nodka Team Attending FABTECH 2025 – IPC and HMI for Metalworking Automation
- Nodka Team Attending ProMat 2025 Focusing on Industrial Automation Solutions
- Nodka at Embedded World 2025 Showcasing the Latest of Industrial Computing and Automation
- Nodka Team Attending AHR Expo 2025 – Focusing on HMI, AI, Smart Control, and IoT Gateways